High Speed SMT Pick and Place system designed for customers who have a wide part mix with higher production volumes. The Mx400 series of pick and place machines utilize next generation linear motor technology providing speed and placement accuracy
Product Name MMA Power（W） 0.5W,1W,2W Output Voltage(KV) ,0.1,0.2,0.3,0.4,0.5,0.8,1.0,1.1,1.25,1.5,2, ISO9000:2008 certified precision module .The MMA Series is ideal for OEM applications requiring a competitively priced, precision high voltage
Mid-level SMT Pick and Place system designed for customers who have a wide part mix with medium to higher production volumes. The Mx200 series of pick and place machines utilize next generation linear motor technology providing speed and placement
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production
New Equipment | Industrial Automation
This is Tiffany Email: sales@askplc.com Whatsapp:+8618030235313 Skype: dddemi33 QQ: 2851195473 Our Website: www.askplc.com OUR ADVANTAGE ★Allan-Bradley ★GE ★TRICONEX ★YOKOGAWA ★ABB ★Ovation ★BENTLY NEVADA ★HIMA ★FOXBORO ★BACHM
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
L size 2.0 ±0.1mm W size 1.25 ±0.1mm T size 0.6 ±0.1mm External terminal width e 0.2 to 0.7mm Distance between external terminals g 0.7mm min. Size code in inch(mm) 0805 (2012M) Specifications Capacitance 220pF ±5% Rated voltage
L size 2.0 ±0.1mm W size 1.25 ±0.1mm T size 0.6 ±0.1mm External terminal width e 0.2 to 0.7mm Distance between external terminals g 0.7mm min. Size code in inch(mm) 0805 (2012M) Specifications Capacitance 1000pF ±10% Rated volta
New Equipment | Coating Equipment
Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettability Enhances lead coverage Improves adhesion Systems
SMT Grounding Gasket Large conformable contact area for low DC resistance throughout vehicle ser vice life due to patented construction Reduced electromagnetic interference (EMI) and crosstalk in challenging environments Reduced likelihood of e
