Electronics Forum: 2

Adhesive Application by Stencil

Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra

RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr

How to PROPERLY interpet a supplier's paste profile documentation & specification?

Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef

I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

Re: Dicing Operation

Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman

I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef

There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows

Rosin vs. Resin Flux

Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala

Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or

Samsung CP45 SSA Import

Electronics Forum | Wed Apr 01 10:52:59 EDT 2015 | superlen

Oh, I forgot to add a sample of what my export looks like. Note: that I don't have anything in the VERSION block & I wonder if this might be a problem. [VERSION] [PCB] Unit System = MILIMETER Coordinate = LOWER RIGHT Rotation = 0 Placement Ori

Re: Passive SMD components codification

Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F

Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When

Re: Passive SMD components codification

Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F

Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When

Solder balls

Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef

IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00


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