Electronics Forum: 5mils (Page 6 of 35)

The increased component height after reflow

Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss

Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss

Resistor Net Array , Stencil Design

Electronics Forum | Tue Mar 25 15:36:38 EST 2003 | Ren� Sandoval

What is the optimal design for the resistor Net Array 0402 (8 pins)with a 5 mils Stencil th.?

Tombstone defect

Electronics Forum | Fri Sep 26 16:53:44 EDT 2003 | V_Sa

Yukim, I had experienced this problem with 0402 package. I resolved it 100% by reducing stencil thickness from 6 mils to 5 mils and changing the apetures from 1:1 to homebase.

stencil thickness for bga

Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint

Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT

Solder Bursting

Electronics Forum | Sat Feb 14 12:33:30 EST 2004 | agp

We are currently experiencing solder bursting in one of our smt reflow lines. Burst as small as 5mil diameter are messing gold fingers of the pcbs. Anybody who have experienced same problem? Would appreciate any suggestion.

PCB Supplier

Electronics Forum | Thu May 13 17:11:48 EDT 2004 | Longhua

We are looking for PCB suppliers capable of building .5mm through hole boards. Internally, we require 5 mil traces, sometimes 4 mil. Our preferred material is Polyimide or BT Resin, and perhaps FR408. All help and/or recommendations is greatly appre

Fine pitch & PCB finish

Electronics Forum | Tue Feb 22 12:03:32 EST 2005 | russ

You may to reduce a little bit more with HASL. for .4mm pitch and such I would maybe go to a 5 mil with your standards.

Stencil thickness

Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng

The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.

Solder bridging after printing

Electronics Forum | Sat Jun 25 10:04:08 EDT 2005 | ktron

Hi MSK, Stencil thickness: 5mils with laser cut Smallest pitch: 20mils Underscreen cleaning frequency: 10 bds per cleaning Note: We have decreased the cleaning frequency from 10 boards to 3 bds to reduce solder bridging after printing Regards,

Lead Free Stencil Design

Electronics Forum | Thu Jul 14 11:44:18 EDT 2005 | Tom

Thanks Again Everyone! One more question... Do you suggest to use 5 mil stencils? My existing stencils are all 6 mil and 8 mil. Should I change them?


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