Industry Directory | Consultant / Service Provider / Manufacturer / Other
Spectra-Tech is a contract manufacturing company located in Cincinnati, providing exceptional service, quality and value. Our core services are printed circuit board (PCB) assembly box-build and assembled cables.
Industry Directory | Manufacturer / Other
DNA Group is a supplier of custom PCBA s, switches and many other board components as well as complete product builds.
Two non-latching user inputs (three screw terminals; Record, Common & Stop) External power supply (6 to 9.5 VDC) Unit switch on with short circuit applied to REC input and start recording Unit stop recording and switch to soft off with short circuit
Two non-latching user inputs (three screw terminals; Record, Common & Stop) External power supply (6 to 9.5 VDC) Unit switch on with short circuit applied to REC input and start recording Unit stop recording and switch to soft off with short circuit
Used SMT Equipment | In-Circuit Testers
Fluke 810 Vibration Tester The Fluke 810 Vibration Tester is the most advanced troubleshooting tool for mechanical maintenance teams who need an answer now. The unique diagnostic technology helps you quickly identify and prioritize mechanical p
Used SMT Equipment | In-Circuit Testers
Fluke 810 Vibration Tester The Fluke 810 Vibration Tester is the most advanced troubleshooting tool for mechanical maintenance teams who need an answer now. The unique diagnostic technology helps you quickly identify and prioritize mechanical p
Used SMT Equipment | In-Circuit Testers
Fluke 810 Vibration Tester The Fluke 810 Vibration Tester is the most advanced troubleshooting tool for mechanical maintenance teams who need an answer now. The unique diagnostic technology helps you quickly identify and prioritize mechanical p
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Industry Directory | Manufacturer
EMSYDEL Electronics is a India based EMS services company capablae of working with complex Boards using SMT, THT lead free services. Run by technocrats , EMSYDEl differentiates itself through a planned and Tailored client benefits association.
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
3F, B5 Dong, Zhimeihuizhi, FuYong, Bao'an Dist.
Shenzhen, China
Phone: 008675529630063