Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon
| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like
Electronics Forum | Mon Jun 18 15:54:25 EDT 2001 | Gil Zweig
For BGA inspection, it is my feeling that he most effective technique a facility can use is the combination of a transmission x-ray system in conjunction with an endoscope (side viewing optical microscope). In using the transmission x-ray inspection
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Mon Sep 21 01:57:55 EDT 2009 | kaz
Hello All, My first visit here. I own and operate a small Industrial & Consumer Electronics Service Shop. There is more and more modules with high density fine pitch SMDs that we cannot handle. We bought PACE ThermoFlow BGA SMD station with a bunch o
Electronics Forum | Tue Mar 01 13:48:49 EST 2011 | davef
Kim, Just add a new posting to this thread then.
Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr
Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.
Electronics Forum | Fri May 25 09:50:23 EDT 2007 | ck_the_flip
Grant, the BGA Kid's got a great point. You state, simply that you're looking to completely replace wave soldering with selective soldering, but the only reason given was "the wave is old". The throughput differences will be huge if you're solderin
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Mon Dec 28 14:51:06 EST 2009 | spitkis2
That's not going to work in this case. The substrate has very small pads designed for a micro BGA die. Thanks for the suggestion though.
Electronics Forum | Tue May 13 20:48:10 EDT 2008 | davef
Rob On your thermal recipe: Above liquidous for nearly 2 minutes seems to be a scoush long. Not sure you're doing anything positive with things like that. On the article: * SMT Magazine, October, 2002, p24 'Q & A: BGA Dewetting' * "Q: Our manufactu
