Electronics Forum: annular ring (Page 6 of 7)

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Tue Aug 31 03:37:19 EDT 1999 | Wolfgang Busko

| | | | | Planning to evaluate the above process... | | | | | Can anyone can give me some tips/infos on the above.... | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the

Help! BGA Socket / BGA Direct Placement

Electronics Forum | Mon Nov 11 17:32:50 EST 2002 | dphilbrick

We have a tidy clause in our contract where as we are not responsible for functionality of prototypes. With that in mind we do what ever the customer is willing to pay for! Experiment away my boy! Now for my two centavos on your question. Without s

Wave Solder Non wetting holes

Electronics Forum | Wed May 18 14:58:05 EDT 2005 | splice

Hi, I am having some PTH non wetting issues. Setup and chronology of events is explained: Set Up; Part: 1 MM pitch connector 378 pins Solder: Kester Ultra Pure 63/37 solder Pot; 250 C pre heat; Peak 94C top side Flux: Qualitek 775, Fluxer: foam T

how to prenvent flux risidue in the blind vias.

Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef

Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi

Who Makes Good boards?

Electronics Forum | Mon Jul 21 19:04:34 EDT 2008 | jmelson

I've been using E-teknet for the last couple years, for a wide range of boards from 2 to 6 layers, and one of the 6-layer boards has an insane density and a zillion close-packed vias. Sam at E-teknet guided me through tuning the board design to opti

Standard for automated placement & assembly, density etc.

Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef

The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize

Re: Intrusive soldering

Electronics Forum | Tue Mar 23 23:17:03 EST 1999 | Chris G.

| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print

Re: En-Tek Coating

Electronics Forum | Tue Oct 06 17:17:44 EDT 1998 | Chrys

| We are experiencing poor wetting on various components placed on a PCB with En-Tek coating. Is anyone else experiencing simular problems ? We have the following questions: | | 1. How can the thickness of the En-tek coating be measured? | 2. Is En

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon

| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri

Wave Soldering Ceramic PCB's

Electronics Forum | Wed Aug 08 21:18:15 EDT 2001 | davef

Get-out the razor blades, bud. You could run that sukka for 6 sec dwell, cook breakfast on it, and you still will not get fill. [Hole file that is, breakfast will go along ways if peckish, though.] You could fire-up the depleted ozone rework gun [


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