Industry News: aperture (Page 6 of 27)

FCT Assembly Launches NanoSlic® Gold Stencil

Industry News | 2014-01-22 11:00:42.0

FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing.

FCT ASSEMBLY, INC.

Standard Gerber Declared Obsolete.

Industry News | 2014-06-24 14:40:24.0

Standard Gerber is technically obsolete. If you are still using it, you are putting your business and that of your clients and business partners at a useless risk, without benefit.

Ucamco

Licensed Stencil Manufacturers Feature Florida CirTech’s NanoSlic Coating

Industry News | 2016-02-24 15:57:12.0

Introduced to the electronics market in 2014, NanoSlic is a proprietary thermoset polymer coating that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance. FCT has developed not only the breakthrough chemistry, but also the equipment and application process that provide a turnkey stencil coating solution, NanoSlic Gold. Though used in multiple markets (www.nanoslic.com) for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

FCT ASSEMBLY, INC.

Horizon Sales Introduces Mobile Sonic Stencil Cleaning System

Industry News | 2022-10-28 13:54:47.0

Horizon Sales is pleased to introduce the new Mobile Sonic Stencil Cleaning System. The Mobile Sonic provides tabletop storage for stencil cleaning supplies and a point-of-use system for fast, efficient cleaning and change out.

Horizon Sales

High-Tech Conversions’ GREEN MONSTER Is Both Tough and Green on PCBs

Industry News | 2009-08-19 19:55:21.0

EAST WINDSOR, CT — August 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that its GREEN MONSTER formulation has the abrasion resistance to withstand the high friction caused by the wiping action, the integrity to resist fibers from being pulled off by sticky solder paste, and the toughness to withstand the harsh scraping and grating action caused by the stencil’s apertures.

High-Tech Conversions

Indium Corporation Expert to Present at SiP Conference China

Industry News | 2021-08-28 04:15:29.0

Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.

Indium Corporation

GraphiCode's GC-CAM 4.1.4 Software Increases Speed, Accuracy and Ease of PCB Fabrication

Industry News | 1999-12-21 15:21:34.0

GraphiCode announces the release of GC-CAM 4.1.4, a software program that provides total control of manufacturing data, PCB design and verification for the fabrication of printed circuit boards (PCBs).

Graphicode

Fine Line Stencil to Premier New Technologies and Company Updates at APEX 2008

Industry News | 2008-03-12 15:38:55.0

Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.

Fine Line Stencil, Inc.

Latest VectorGuard� Technology from DEK Earns Advanced Packaging Award

Industry News | 2008-07-24 18:07:41.0

When DEK's revolutionary VectorGuard� stencil technology was introduced six years ago, the company pledged ongoing engineering investments to deliver foil designs to serve countless next-generation applications. Living up to this promise, DEK's latest advance, VectorGuard Platinum�, was introduced last week at Semicon West and its ingenuity earned a prized Advanced Packaging Award.

ASM Assembly Systems (DEK)

Seika Machinery, Inc. to Highlight New Cleaning Solutions at the High Performance Cleaning and Coating Technical Conference

Industry News | 2010-11-06 17:45:03.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its latest environmentally responsible cleaning solutions at the upcoming High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.

Seika Machinery, Inc.


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