Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
General Purpose (SMT and Leaded Styles): Aluminum Electrolytic, Tantalum Electrolytic, Ceramic (discrete and arrays) and Film
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
Many styles of standard component forming pliers, insertion/extraction pliers, shear cutters, standoff cutters, wire strippers and component prep tools for a wide array of special uses. For more information please visit our website
Affymetrix offers target labeling and control reagents for use with GeneChip� expression analysis and GeneChip� DNA analysis arrays. For more information please visit our website
ASAP NSN is an authorized and value added distributor of a wide array of military ships and marine equipment. Browse our inventory to find any type of new and hard-to-find parts.
The GeneChip� Instrument System, the most advanced microarray analysis platform available, reduces the time and cost of discovery research. With the integrated GeneChip Instrument System, you can generate reliable, reproducible genetic analysis data.
SST offers a full range of electronic manufacturing services to its customers. With the ability to offer both turn-key and consignment manufacturing for nearly any size project, we stand ready to become your manufacturing partner. SST offers a wide r
Z-Con Assemblies are made with Z-Axis Connector Elements inserted into standard or custom housing shells. They are the equivalent of traditional mechanical connectors and are available in single or multiple slot configurations or arrays. Using Stereo
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
