Electronics Forum | Tue Feb 02 09:47:45 EST 1999 | Justin Medernach
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | Hi Al, A BGA should be looked at just like any other surface mount device. However, just
Electronics Forum | Tue Feb 02 17:51:45 EST 1999 | gcollier
| | Hi everybody. | | Somebody know any consideration or special care to make a profile for BGA's. | | | | any advice is aprecied. | | | | thanks | | Al Carrillo | | | | | Hi Al, | A BGA should be looked at just like any other surface mount d
Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Her
Electronics Forum | Sat Jun 06 07:04:27 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Wed Mar 10 20:13:23 EST 1999 | Earl Moon
For Dean and the rest of you interested, I have reconciled many of my thermal issues with this machine and its peculiarities. The bottom side heater seems adequate, at 750 watts (not going to spend 10 grand extra for 500 more watts no matter what) a
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Mon Apr 26 12:03:22 EDT 1999 | Justin Medernach
| Help Guys!! | | We sub con assemble small to medium batch runs of mixed tech boards inc fine pitch BGA o4o2 etc. | | As usual we get all the crap to build that no-one else wants, however lately some customers are getting a little more serious wit
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