Electronics Forum: bga on bottom side (Page 6 of 34)

Tomb-Stoning. What's going on here?

Electronics Forum | Wed Jan 18 02:00:36 EST 2006 | pavel_murtishev

Good morning, This isn�t very strange. Bottom side components are prone to tombstoning more than topside ones. Try to reduce oven�s bottom heaters temperature slightly to prevent solder paste melting on bottom side. This can help. BR, Pavel

Tomb-Stoning. What's going on here?

Electronics Forum | Tue Jan 17 11:52:07 EST 2006 | pms

Got a wierd one here, 0402's tomb-stoning. Scenerio---- Double sided PCB, paste both sides, 0402 on both sides. Reflow bottom side first--- no problems. Reflow topside next----no problems with topside components, BUT, the bottom side that was ref

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie

We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro

SMT on top or bottom?

Electronics Forum | Tue Feb 27 15:20:03 EST 2007 | slthomas

Put 'em all on one side unless you have a reason to split them up.

Component size on double-sided PCB

Electronics Forum | Mon Jun 07 14:47:22 EDT 2004 | Mark

It matters on how you setup your oven profile. I have placed J-leads on both sides with no problems. Also, have come across some fine pitch but wouldnt suggest this too often. Give some examples that he would like to see placed on the bottom side of

Inspection criteria on PIH parts

Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard

Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect

OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 12:36:53 EDT 2005 | smt_rookie

I've tried a different lot of the same double header connector (yes its double level right angled header conector) twice but nothing has improved. I've also suspected that top row of the connector has greater heat sinking capacity (which should hold

SMT on top or bottom?

Electronics Forum | Tue Feb 27 15:23:53 EST 2007 | jdengler

As already stated one side. Also if at all possible change the through hole components to SMT. It is much cheaper to assemble SMT than through hole. Jerry


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