Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton
Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA
Electronics Forum | Thu Feb 10 04:07:29 EST 2000 | Wolfgang Busko
Jeff: We had a similar problem a couple of years ago with boards from one specific subcon. At first sight the joints looked well formed sometimes with a little bit more sometimes with a little bit less solder but still in limits not to be worried abo
Electronics Forum | Sun Aug 06 14:02:04 EDT 2000 | David Harper
The company I work has been assembling this particular board for several years now, and one thing has always remained constant. Bad Soldering. The board is a double sided board, the solder side has about 250 1206 caps & resistors and Sot-23 transisto
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Fri Feb 19 14:44:24 EST 1999 | Lance A. Smalley
You don't say what kind of machine you are using but several just use the edge of fiducials to determine area (and centers). If you are teaching in binary and have the ability to select a decision level (threshold), use a level half way between loss
Electronics Forum | Tue Jul 28 07:02:59 EDT 1998 | smd
Right now we are taping the goldfingers which is effective but also expensive. Also, some tape was leaving yellow marks on the goldfingers. We're trying the so-called goldfinger glove from Steven's Products. It's a very small company (probably one gu
Electronics Forum | Mon Aug 03 08:29:24 EDT 1998 | Dave F
SMD: Sounds interesting. What is the contact information on Steve? Dave F | Right now we are taping the goldfingers which is | effective but also expensive. Also, some tape was leaving yellow marks on the goldfingers. We're trying the so-called go
