Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Tue Feb 26 10:42:48 EST 2002 | davef
Consider the hierarchy presented in http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18112
Electronics Forum | Tue May 13 20:48:10 EDT 2008 | davef
Rob On your thermal recipe: Above liquidous for nearly 2 minutes seems to be a scoush long. Not sure you're doing anything positive with things like that. On the article: * SMT Magazine, October, 2002, p24 'Q & A: BGA Dewetting' * "Q: Our manufactu
Electronics Forum | Mon Dec 28 14:51:06 EST 2009 | spitkis2
That's not going to work in this case. The substrate has very small pads designed for a micro BGA die. Thanks for the suggestion though.
Electronics Forum | Tue Dec 04 09:35:58 EST 2001 | jdill
I have successfully reflowed 208,100 pin QFP'S and SOJ 28's on the bottom side of the board. The only thing i am "SCARED" to reflow on the bottom side are BGA'S. We used to turn off the bottom heaters but we did a trial run with them off and the boa
Electronics Forum | Fri May 17 14:23:34 EDT 2002 | dason_c
I will convinced to change to the no clean process by environmental safe even though clean process is water soluble but it still produce the waste. Also, the BGA is not recommend to clean, if the flux is not completed removed from the board and elec
Electronics Forum | Fri May 25 09:50:23 EDT 2007 | ck_the_flip
Grant, the BGA Kid's got a great point. You state, simply that you're looking to completely replace wave soldering with selective soldering, but the only reason given was "the wave is old". The throughput differences will be huge if you're solderin
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