New Equipment | Solder Materials
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,
New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
High-spec & Performance 3D Post Reflow Bump Inspection System Highly Reliable and Accurate Inspection System No Shadow Effect & No Specular Problem Capable of Co-Planarity / PCB Warp Inspection
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus
Industry Directory | Manufacturer's Representative
ASE is contract IC assembly and test manufacturer situated in Penang Malaysia. Establishing wafer bumping capability is one of key program for year 2001 which I am given the task to start and establish. I am in search of any relevant technical papers, studies, technical bulletin to wafer bumping.
Parts & Supplies | Pick and Place/Feeders
Product Description: Product Name: Philips smt feeder station(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is ma
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
