Electronics Forum | Mon Oct 25 17:55:47 EDT 2004 | Mike
Circuit Science, Inc. Plymouth, MN Mike Dupont / Sale Mgr. www.circuitscience.com miked@circuitscience.com Please send me an email and we will take a look at your pcb. We have been in the PCB industry for over 30 years. 2 layer boards - 18 lay
Electronics Forum | Tue Jun 05 14:04:11 EDT 2007 | hussman
We have the same situation here. But generally it is the customer gives us a 1-up Gerber drawing and we need a multi-up or some form of breakaway to make the product. The way we achieve this is thru a Word document we call PCB Guidelines. We attac
Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Electronics Forum | Thu Jul 26 12:04:16 EDT 2018 | wendymm
RS-274X file contains the complete description of a PCB layer image without requiring any external files. It has all the imaging operators needed for a PCB image. Any aperture shape can be defined as well as positive and negative objects. Maybe that
Electronics Forum | Fri Jul 30 10:30:23 EDT 1999 | Wolfgang Busko
| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w
Electronics Forum | Fri Jul 30 16:06:22 EDT 1999 | Earl Moon
| | | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That
Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon
| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili
Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley
| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Tue Sep 01 02:57:42 EDT 2009 | d0min0
davef As for the repair : - with hot air blower it is not possible (you can melt, but it will not wet) - with standard iron - no problem to repair (no additional material is needed) isd.jwendell yes, the profile is checked on those places (same si
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