Electronics Forum | Tue Jun 07 21:10:53 EDT 2016 | deanm
The first thing I would do is give Alpha a call and talk to their tech support about it.
Electronics Forum | Mon Aug 27 10:58:44 EDT 2001 | Ryan Jennens
Steve- We had the same trouble with 0805 Panasonic film caps. We had some tombstoning and open solder joints (non-wetting). We found two problems...like you, we changed our pad design to meet their recommendation. Also, they were able to suppl
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Thu Aug 23 16:01:59 EDT 2001 | Steve
You made the statement "The rest of the board we use them on looks great..." My question is, what's the difference between the assemblies? Mass? Solder? Oven? Are the boards the same thickness, are other parts causing heat sinking, etc. The reflow m
Electronics Forum | Tue Aug 28 16:07:09 EDT 2001 | slthomas
Just talked to my component engineer. We use the B parts also, and apparently the B suffix indicates compatibility with wave or reflow applications, X is for reflow only. Since we only reflow these parts, sounds like that might be the best route fo
Electronics Forum | Thu Aug 23 15:45:48 EDT 2001 | slthomas
So, we've already addressed the tombstoning on these guys by adopting the mfr's (Pana.) recommendations for pad size and spacing. Problem is, we have pretty bad wetting of some of these parts. The rest of the board we use them on looks great, nice
Electronics Forum | Thu Aug 23 16:41:06 EDT 2001 | slthomas
Naw, the rest of the BOARD we use them on. Same assembly. Actually we use them on one other assembly and have the same problem. Same oven, same line, same paste, same problem. I've tried to get the production super. to move them to another line w
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
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