Electronics Forum | Fri May 29 08:22:09 EDT 2009 | scottp
It would help to see pictures, but I suspect the parts are seeing excessive strain when snapped into or removed from the pallet.
Electronics Forum | Sun Sep 25 16:02:59 EDT 2005 | mark
The calibration was ok. When i switch off the back camera and use front one everything is ok. Is it true that when Topaz use back line camera after checking the components the machine rotates the components 180 degree?. Mark \
Electronics Forum | Mon Jan 18 06:31:27 EST 1999 | Marcus Wagner
Hi, I�m searching for manufactores of lead-free components (resistance, capacitors ...) Do you know adresses, websides ... to get some information? Please tell me.
Electronics Forum | Mon Sep 26 07:56:38 EDT 2005 | pavel_murtishev
Hi! Try to make "R_AXIS_ACCURACY" calibration for all of FNC heads for back camera only. I met such problem on Topaz-X. There was clearly seen offset on 0.8mm pitch components. I simply calibrated all cameras for FNC nozzles and problem disappeared.
Electronics Forum | Thu Mar 22 11:23:42 EDT 2007 | Stefan
Hi, Can somebody tell if for melf components the x and z sizes are the same? Normally they are, but the machine's vision system sees only 60-70% of the x size due to light dispersion. The Z dimension has to be the one measured with a vernier caliper?
Electronics Forum | Fri Mar 23 07:17:50 EDT 2007 | Phil J
Stefan The Z hight required for a MELF will depend on the design of nozzle used on your machine. If it has a "V" tip you should measure the hight of the component on a nozzle then subtract the nozzle hight.
Electronics Forum | Wed May 27 07:02:34 EDT 2009 | xinxi
Have you tried profiling the board with temperature label or profiler thru wave? I reckon your pre-heat temperature might be too high either on top or bottom and cause the component to expand unevenly. Regards, xinxi
Electronics Forum | Fri May 29 02:02:07 EDT 2009 | cobar
The problem could be that the preheat temp of the PCB is too low on entering the bath.Also look at moisture ingression of components.Have a look at solder Assit at http://www.shanelo.co.za
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
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