Electronics Forum: contaminated leads that cause poor wetting (Page 6 of 10)

Immersion White Tin

Electronics Forum | Mon May 14 14:34:05 EDT 2007 | rgduval

I have to agree with Jax. We've had some successes, and some horrible failures using white-tin. Generally in solderability, and apparently related to the somewhat more rapid deterioration of white-tin finishes. We've run white-tin as an SMT only

Re: Squeegee Pressure

Electronics Forum | Tue Feb 16 02:19:29 EST 1999 | Joe

| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the

Re: PASTE LEACHING

Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F

Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.

Tip life of soldering irons with lead-free (SAC305)

Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1

Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven

| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |

Sn/Pb diffusion

Electronics Forum | Fri May 03 06:03:26 EDT 2002 | geoff_goring

Dave Many thanks for your very informative piece on SMT.com As we stand we have not yet 'seen' any problem. My issue is that we have ordered (LTB) a very large quantity of ASICS and our usage has taken a down-turn. We therefore need to keep the one

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

Re: Hey Ya'll, let's talk about Lead fer' a bit...

Electronics Forum | Wed May 05 03:57:00 EDT 1999 | Bernard Mulcahy

| Hi Ya' John! | | Here's my comeback to the points you've raised...you knew I would have a comeback, didn't ya'? | | |Steve, | | | | I see your point, and yes there are alot bigger fish to fry in |the removal or control of lead in the environment

Freshman in SMT industry needing advice

Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara

As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep

Stencil cleaners.

Electronics Forum | Mon Jul 17 13:37:35 EDT 2006 | carln

Here is something I copied from Circuitnet.com. This appears to answer your question and then some... http://www.circuitnet.com/experts/ Ask the Experts Jul 17, 2006 What type of cleaner method is preferred for lead-free stencils? What type of s


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