Industry News: copper foil crack (Page 6 of 8)

Indium Corporation Expert to Host Power Electronics Webinar

Industry News | 2020-06-18 14:22:04.0

Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Indium Corporation

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Indium Corporation Honored with Two Global Technology Awards at Productronica

Industry News | 2023-11-20 15:34:41.0

Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.

Indium Corporation

Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo

Industry News | 2023-09-25 17:55:00.0

Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.

Indium Corporation

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

FCT Assembly to Showcase Proven Solder Paste and Stencil Technologies at SMTA International 2011

Industry News | 2011-09-21 13:59:11.0

FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.

FCT ASSEMBLY, INC.

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:23:30.0

FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.

FCT ASSEMBLY, INC.

Cobar’s Advanced Technologies Featured in the APEX Hand Solder Competition

Industry News | 2012-04-10 14:47:49.0

The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego.

Cobar Solder Products Inc.

Io Audio Technologies Zero Halogen Jacket Cat 6 Wire released by New Yorker Electronics

Industry News | 2022-02-01 21:05:46.0

Low-Smoke, Zero Halogen Cable is designed for Longer Cable Runs and Increased Signal Integrity

New Yorker Electronics


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