Industry Directory | Manufacturer
Permabond is a leading manufacturer of engineering adhesives, supplying high-quality industrial adhesives to customers worldw
Industry Directory | Manufacturer
United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.
Technical Library | 2020-02-14 14:43:21.0
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.
Industry News | 2013-06-10 12:32:44.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
We offer a full range of SMT adhesives that are suitable for markets ranging from automotive to consumer electronics and everything in between. These adhesives are suitable for all common application methods including printing, standard and high spe
Used SMT Equipment | Adhesive Dispensers
MRSI-170 Gantry Adhesive Dispenser, die bonding, working condition, good for a project machine / prototype applications. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
Permabond 2-part epoxy adhesives are suitable for bonding a wide variety of materials. Available with a range of different cure speeds to suit, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applic
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
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