Electronics Forum | Thu Dec 12 15:34:59 EST 2002 | msimkin
Has anyone had any expereince with FR4 boards under the std 0.5% warpage for Bow & twist with CSP & uBGA devices on them that have caused failures. Are there any revised percentages for boards loaded with these devices that anyone knows of, istead of
Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto
Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it
Electronics Forum | Fri Apr 30 22:19:57 EDT 2004 | Bryan She
Oh,the CSP outline is 5x5 mm,It's hard to attach such a thermal couple on J6 ball.Ok,I'll have a try.Thanks. In addition,I found that most of the balls are on some big copper sheets except the J1,J6 and J7 balls.defects happen only on J6. Thanks. Br
Electronics Forum | Wed Mar 16 06:52:00 EST 2005 | Bob R.
I won't speak for the person asking the original question, but one reason I can think of is in a high reliability application where the CSP needs underfilled and, depending on the underfill, cleaning may be necessary for underfill adhesion. Why use
Electronics Forum | Mon Jan 23 10:06:17 EST 2006 | GCO
I would like to say sharing new parts only, it seems that we have a little problem teaching new BGA's or CSP's with actual vision system (very time consumming). - see FUJI site for an add-on off line unit if needed ($$$...HIC!). Any better solution o
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Fri Aug 05 18:10:11 EDT 2011 | davef
* Attaching thermocouple to CSP or BGA is a challenging task. Usually a hole is drilled at the center and the thermocouple is routed through the bottom of the board and to the area of interest. In particular, since the CSP stand off is very small, a
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
