Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp
Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan
Electronics Forum | Tue Feb 24 15:52:58 EST 2015 | swiese242
We currently have around 20k+ components in stock. I would like to have some opinions on creating a more lean manufacturing system. We check stock in our system and then order parts. Most of time leading to employees looking for parts, or shorts. We
Electronics Forum | Tue Sep 13 10:00:27 EDT 2016 | awhite
Switched out the mech. relay on the board loader, no change. Same behavior. Could not find a mech. relay on the printer... SMEMA wiring appears go directly to a PCB. And it is at that point that I run out of talent. If the machine weren't dedicate
Electronics Forum | Fri Apr 10 10:31:47 EDT 2020 | proceng1
Certain customers do give us CAD. USUALLY ODB++ but I've also gotten .ipc and .pcb . Many of our customers bought or inherited a design, and therefore have no control to generate additional files. Or, as you mentioned, they had another manufacture
Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny
Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to
Electronics Forum | Thu Jul 14 16:05:55 EDT 2005 | russ
Good answer slthomas! This has got to be the biggest misconception out there. To perform SPC on a wave process you must first perfrom DOE to determine the critical parameters and or control limits. For example you will need temp reading devices tha
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Mon Apr 26 17:31:14 EDT 1999 | Earl Moon
| Hey MoonMan, | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop! "Foiled"
Electronics Forum | Thu Mar 06 11:37:17 EST 2003 | msivigny
Hello Phil, sorry for the confusion, because of our level of defect control and tracking at each process step, we did not use AOI systems at the time. We had a manual inspection station after reflow, then ICT and Functional/Final test for each produc
