Full Site - : die attach wire bond (Page 6 of 56)

Dispensing Tool

Dispensing Tool

New Equipment | Dispensing

For Die Attach / Die Bonding / Housing Attach / Housing Bonding

K-Net International Ltd.,Part

Rubber Tip

Rubber Tip

New Equipment | Pick & Place

For Die Attach / Die Bonding / Housing Attach / Housing Bonding

K-Net International Ltd.,Part

RBC Industries, Inc

Industry Directory | Manufacturer

Manufacturers of high performance epoxy and silicone resins for potting/encapsulating, coating, bonding, sealing, and die attach. Thermally conductive, UL listed systems for electronic, electrical, & industrial applications.

R&D Money

Industry Directory |

Quality precision die bonding / pick and place tools, collets, ejector pins, wire clamps

NEO Tech to Showcase Leading Medical Design & Manufacturing Solutions at MD&M Minneapolis 2016 Exhibition

Industry News | 2016-08-22 19:02:37.0

NEO Tech announces that it will highlight its medical design service solutions, as well as medical device repair and refurbishment, and miniaturization services for implantable medical electronics in booth 2445 at the 2016 MD&M Minneapolis Exhibition, scheduled to take place September 21-22 at the Minneapolis Convention Center.

NEO Technology Solutions (NEO Tech)

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Inseto (UK) Ltd

Industry Directory |

Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)

ESEC

Industry Directory | Other

Supplier to backend semiconductor packaging.


die attach wire bond searches for Companies, Equipment, Machines, Suppliers & Information

Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
Conductive Adhesive & Non-Conductive Adhesive Dispensing

High Resolution Fast Speed Industrial Cameras.
Pillarhouse USA for handload Selective Soldering Needs

Easily dispense fine pitch components with ±25µm positioning accuracy.
High Throughput Reflow Oven

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...