Industry News: dipping and profile (Page 6 of 32)

Vyrian Incorporated Purchases Hentec/RPS Pulsar Solderability Test and Photon Steam Aging Systems

Industry News | 2022-03-28 21:03:04.0

Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.

Hentec Industries, Inc. (RPS Automation)

KIC to Participate in SMART Group Temperature Profiling Workshop and Demonstrate New Generation Thermal Profiler

Industry News | 2008-10-20 20:29:37.0

San Diego � October 2008 � KIC, the leader of thermal process development and control products and winner of multiple industry awards, will participate in the SMART Group's Practical Step-by-Step Temperature Profiling Workshop, which will be held at The Oxfordshire in Thame, Oxford in the UK on 28th October. Repeatable temperature profiling is at the heart of any good process and the event will address reflow, selective, wave soldering, rework and curing profiles.

KIC Thermal

SolderLab Tests Solder for Impurities Based on J-STD-006C and J-STD-001F – Find Out How at APEX

Industry News | 2016-02-18 20:27:15.0

SolderLab today announced plans to exhibit in Booth #2913 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The company tests solder for alloy impurities based on industry standard IPC guidelines for J-STD-006C and J-STD-001F.

SolderLab.com

ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

Industry News | 2012-05-31 14:49:02.0

Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.

Electronic Controls Design Inc. (ECD)

Seika Machinery Introduces the MALCOM DS-10 Dip Tester

Industry News | 2016-01-25 10:44:17.0

Seika Machinery is pleased to introduce the MALCOM DS-10 Dip Tester. The tester provides data transmission to a PC by USB cable, creating a profile function. The dedicated software implements a high level of process management.

Seika Machinery, Inc.

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste

Industry News | 2015-10-13 19:27:42.0

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (

Shenmao Technology Inc.

SolderStar Announce a New Sales and Support Partner in Spain

Industry News | 2015-02-01 19:09:47.0

SolderStar has announced the appointment of Nufesa Electronics as a new sales and support partner for Spain.

Solderstar

SolderStar Announce a New Sales and Support Partner in Brazil

Industry News | 2015-04-30 20:04:18.0

SolderStar Ltd, is expanding its sales and support service into Brazil with the appointment of Plottec Servico de Informatica as a full distributor.

Solderstar

KIC in Booth #3101 at SMTAI: Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability

Industry News | 2021-10-07 15:10:50.0

KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.

KIC Thermal

Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability from KIC at SMTconnect

Industry News | 2022-04-13 10:14:24.0

KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.

KIC Thermal


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