New Equipment | Board Handling - Storage
Surface Mount Component Shipper Protects Many Sizes and Styles Eliminates Lead Damage Static Shielding Mailer with Dissipative Inserts 1,2,4 and 10 Paks Available Protect against lead damage SM ComPak® eliminates lead damage when shipping or ha
Our modular workstation systems ergonomically combine superior flexibility with the fastest assembly and reconfiguration available
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of robotic soldering equipment including contact, laser and ultrasonic soldering available in several robotic platforms including desktop, SCARA, cartesian and six axis multi-articulated robots.
Technical Library | 1999-05-06 10:30:06.0
Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ...
Technical Library | 1999-05-06 10:42:58.0
Many of us tend to think of semiconductors as low power, cool devices. But as the number of transistors in an integrated circuit increases, so does power consumption increases and the need to dissipate the resulting heat load. Microprocessors, in particular, consume more and more power with increase in speed and complexity.
Technical Library | 1999-07-20 09:28:38.0
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment...
Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr Made by SHINLY plastics corporation www.shinly.com.tw
esd package (electro-static dissipating) antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: for 10 long dimm / 20 so dimm
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr Specification: 50 so dimm Made by SHINLY plastics corporation www.shinly.com.tw
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