Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22
HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Tue Apr 10 13:43:13 EDT 2001 | mparker
since you did not define what visual process you are inspecting with I will ask is this "grainy" appearance being detected with the naked eye only? Are you using magnification? if so, what power? Is this a SMT solder or through hole solder problem?
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Thu Apr 24 13:35:51 EDT 2003 | fmonette
Hi Jason, Welcome back to SMTnet. I just wanted to clarify one important detail relative to dry packing Moisture Sensitive Devices. Contrary to popular belief, it not necessary to use vacuum when sealing Moisure Barrier Bags. A simple heat seal w
Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Thu Feb 16 13:21:24 EST 2006 | Bill C
Hi Russ, Thanks for the reply. No this is 856, I sprayed some on boards just to try it out and noticed it dries very quickly also but if its soldered right away as would be the case in the machine, it's fine. I believe I tried some 857 and found th
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