Electronics Forum: edge connector design rules (Page 6 of 8)

SMT packages that can solder inverted?

Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B

Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets

Can F4G connect with more than 8 CP7 or QP3?

Electronics Forum | Tue Jun 11 15:56:43 EDT 2002 | mjabure

Actually F4G is a programming environment similar to panatools, not a machine, it stands for "Fuji 4th Generation". The connection being questioned is to the communication network, and yes with the proper hardware you should be able to connect more t

Temperature Probes for Reflow Profiling

Electronics Forum | Mon Jul 16 10:21:29 EDT 2007 | samir

d0mino, Given the fact that the SLIMKic has built in wave detection, you can just make a pallet out of 10mm delmat material, and drill a couple of holes on the pallet for the wave detect T/C's (ports 2 & 3 for left and right). All the wavesurfer is

Re: Things I Like Without Endorsing

Electronics Forum | Wed Jun 02 15:05:59 EDT 1999 | JohnW

| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro

Re: optimized profile

Electronics Forum | Sun Apr 25 11:30:12 EDT 1999 | Earl Moon

| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi

OSP vs HASL

Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri

The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

Waves soldering: not enough solder remaining on pads

Electronics Forum | Mon Jul 31 20:34:58 EDT 2017 | zsoden

Hi all, it has been a bit of a delay but I've finally had a chance to do some further investigation on this. First off, we spend some time to clean the solder bath using Kester Solder Saver and scooped out a lot of crap. We then added about 5kg of

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using


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