Electronics Forum | Sun Apr 18 00:07:23 EDT 1999 | Vic Lau
I have experienced some dewetting problem on the photo-coupler's lead. No matter what types (how strong) the pre-cleaner and fluxes I used, still not completely resolve this problem. I just wonder, why this is so common to have dewetting problem on
Electronics Forum | Fri Nov 13 20:17:35 EST 1998 | Chuck Garth
| | I believe that gold fingers on my circuit boards are being | | contaminated and need to clean them with some chemical | | solution. Any recommendations. | | | Chuck: What is the type and source of your contamination? Dave F | We are using a s
Electronics Forum | Thu Feb 26 20:49:09 EST 1998 | Pedro Pellegrini
We are from Brazil and looking for a special kind of microchips: Encapsulated microchip, battery operated, that drive 1 or 2 LEDs (light emissor diode) to blink (JUST AN OSCILATOR). (like the ones used in promotional musical CD box). we need, under s
Electronics Forum | Sun Apr 21 09:52:07 EDT 2002 | pjc
Francis, The problem with shorter solder lands is you may have a problem getting good heal fillets. In the flash products I built the PCBA was inserted into a plastic shell and then we did an epoxy encapsulation using a Camalot machine. Toshiba, Sams
Electronics Forum | Mon Apr 22 09:07:43 EDT 2002 | pjc
Francis, The potting encapsulation process was in the mfg. of flash-disk devices built on a DIP formfactor. Compact flash do not normally get potted. Ultrasonic welding or snap-togther is methods for closing the compact flash housing. The potting mat
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Thu Aug 14 17:29:15 EDT 2003 | Andrea
We use these but we hand solder. The resistor is basically a wire inside the encapsulant. When we noticed the bowing, we tested about 200 that were on different CCA's. They were all fine. If they want to use these under the wave solder, be sure to lo
Electronics Forum | Sun Feb 01 15:07:10 EST 2004 | rick
Pete C Thank you for answer. Yes we have to remove solder flux so we need chemistry for no-clean flux residue. What kind of damage can i expact from ultrasonics device? you said damage IC and clock types?. We have all components in solid encapsulat
Electronics Forum | Wed Nov 17 08:13:41 EST 2004 | grange GAA
We are manufacturing an NPI board for a Customer and they want us to wash the board using a Saponifier wash. However, one of the SMT parts cannot be placed through a wash process. Has anyone ever had to encapsulate a component to prevent water da
Electronics Forum | Wed May 25 18:33:18 EDT 2005 | russ
We have passed testing using this process, I would consider it on a case by case basis however. We are very careful about the quantity of the O.A. that we use. The water soluble flux is gone after cleaning unless it was/could be encapsulated or tra
