Electronics Forum | Fri Feb 03 15:32:28 EST 2017 | westshoredesign
Not sure exactly what kind of coverage your looking to get but we use Dow Corning 3-1944, it's room-temp cure and rather thick, (think warm honey). But we have found it useful on several projects. http://www.dowcorning.com/applications/search/produc
Electronics Forum | Tue Feb 07 10:25:37 EST 2017 | ttheis
Thanks for the tip. I'm still getting familiar with the machine by reading the manuals as I have time. Was wondering what type of solvent you use to clean the dispensing mechanism parts? Or do you not clean anything and simply dispose of the syring p
Electronics Forum | Mon Feb 20 13:02:22 EST 2017 | ttheis
We tried both of these suggestions and the 3-1953 is less viscous than the 3-1944 so it will flow better on the board for our conformal coating application. What cleaning solvent is recommended for cleaning off the auger parts, etc.? I haven't been
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Fri Feb 03 17:14:49 EST 2017 | westshoredesign
You should have no problem. We use a very dated Asymtek machine (Automove 303) retrofitted for dispensing, air over syringe. It took time and some tinkering with. But all things considered, we're able to achieve remarkable results. I would recommend
Electronics Forum | Mon Feb 06 17:24:26 EST 2017 | westshoredesign
So I had the same question too when I was setting ours up. My lazy (and cheap) solution was: for each program I have a universal path that is used up to the first dispense instruction and after the last one then I covered the surfaces underneath tha
Electronics Forum | Tue Feb 07 12:26:14 EST 2017 | westshoredesign
Oh yeah, so we have a auger valve similar to that on one of our other machines that we use for dispensing SMT glue, and solder paste also. We have a conditioner that we flush it with at EOD when in use, then we just let it sit idle with the condition
Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW
| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
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