Electronics Forum | Thu Mar 25 14:30:29 EDT 2010 | boardhouse
I would not use the product. Solder balls on a massive scale would be one issue due to all the exposed copper. Throw them out, it will be cheaper and less of a headache. I would also question your board shops quality control or lack of for letting
Electronics Forum | Mon Sep 17 05:48:10 EDT 2012 | stivais
Hi Ben, Yes, this could be the reason but have you ever seen solderability issues for (new) boards with LF-HAL surface finish? I have seen this only if there are surface finish quality issues for bare boards (exposed copper etc.). In this case we di
Electronics Forum | Wed Mar 04 22:24:28 EST 2015 | SKR
We are using Nutek NTM4910-XL laser marker to etch 2D barcode on all our boards. We added solid silkscreen box on all our boards to create contrast. When we laser etch them, we just burn the silkscreen box so that we can see the soldermask under it c
Electronics Forum | Wed Dec 11 12:07:33 EST 2019 | scotceltic
Our company has a spec on their current PCB dwg to make sure the fab house meets a specific thickness (min-max). The current spec reads: 13.5um min - 38.5um max. I assume it is to keep the board house honest and to make sure there is no exposed co
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Fri Aug 22 14:24:54 EDT 2008 | boardhouse
Paul, I would do two things, eval whole lot for any etching issues as shown above and scrap and two I would have your copper thickness checked, my guess your copper plating will be low. Check plating thickness in Via holes - if less then 8/10th's r
Electronics Forum | Mon Aug 08 18:59:49 EDT 2016 | oleksz
What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 m
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
Electronics Forum | Mon Jun 14 16:49:08 EDT 2004 | Dreamsniper
Can I manually tin them with solder specially the BGA's. Will that improve the solderability? What about corrosion of the copper? will it be prevented with the above process considering that after tinning of solder the solderability became acceptable
Electronics Forum | Mon Jul 11 08:35:54 EDT 2011 | scottp
I see bare copper on top of some of the leads. Maybe that's normal and acceptable, but I would look at the underside (solderable surface) of the leads on some bare parts to make sure they're properly plated. Poor solderability can be one cause of v
winsouce.jpg)
.gif)
