Electronics Forum: fine and bridging (Page 6 of 43)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 13:51:37 EDT 2023 | calebcsmt

I'm actually currently in the process of discussing with stencil MFG regarding the apertures and reduction to see if perhaps it was not optimal for this fine pitch QFN, as just as you mentioned, we have similar products with similar QFNs that do not

Re: Fountain Wave Soldering and Repair/Rework Equipment

Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys

| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

Re: Siemens HS50 and F5 and S25

Electronics Forum | Mon Nov 27 19:00:52 EST 2000 | Christopher Noonan

When the are up and running they are hard to beat, but when they go down they go down hard. Keep field service close. Don't get me wrong they're great machines and the company I used to work for had some of the first machines available. I come fro

Buying stenciling and pick and place equipement.

Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner

We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

CCGA and overprinting?

Electronics Forum | Fri Oct 12 09:17:12 EDT 2001 | mikecampbell

Hello, I need some advice. I want to create apertures in my stencil for a IBM CCGA. I've heard the standard is 4800 cubic mils of paste per aperture. I usually use a 5mil stencil for this type of product. There is no way I'll get enough paste wit


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