Industry News | 2009-03-10 14:58:48.0
FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2010-10-06 11:52:25.0
FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."
Industry News | 2011-11-20 13:19:41.0
Finetech has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.
Industry News | 2009-12-07 18:50:22.0
Finetech GmbH & Co. KG, manufacturer of SMD rework and micro assembly equipment, will present a new brand identity from November. This stems from a process of change over many years, which is reflected in the sales structures and product range, as well as other areas.
A unique rework system that combines IR radiation with convection heating. Large area pre-heater (bottom heater) provides unmatched temperature uniformity. Available in a standard configuration, as well as an extended base system capable of handling
Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
Industry News | 2010-03-08 17:13:54.0
MARTIN, a FINETECH company, has appointed Scott Rushia as Sales Manager for the U.S., Canada and Mexico. In his new role, Rushia is responsible for sales and service for Martin’s rework and dispensing products.
Industry News | 2007-10-29 16:48:09.0
At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
