Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto
More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.
Electronics Forum | Thu Jun 26 09:04:43 EDT 2003 | caldon
We had a "Spring loaded" fixture that pulled the Flex tight and used loads of Board supports. There were pins that went through the Connectors holes and held the flex firm. We only had a few components so it was no problem. Lucky for us because the f
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Thu Aug 09 09:14:22 EDT 2018 | ks0707
Is there any special machines/equipment which are able to install FBGA parts on the very thin flex boards for Printing, Pick & Place, and Reflow ? Q2> Is there any Fixture house who can offer fixtures to enable SMT processes for those assemblies ? Q
Electronics Forum | Fri May 02 12:41:16 EDT 2003 | Chris Lampron
Hi Chris, I had worked for a flex circuit house for 10 years. You should be able to follow your solder paste guidelines for times and temps. You may want to consider pre-baking the flex if it is made with Kapton. Kapton is Hygroscopic and will delam
Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh
Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson
Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe
Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
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