Electronics Forum | Mon May 10 20:23:43 EDT 2004 | wdlau
Hi, I am looking the practice when you are phasing in the LF wave soldering process of larger boards with Larger AL E- cap, are there any concerns about the heat resistant, is there any risk to damage the E cap as higher temp is a need for larger bd
Electronics Forum | Tue May 22 11:08:12 EDT 2012 | patrickbruneel
It sound like this connector is a serious head sink which can be solved with more preheat or slower conveyer speed. It might also be a combination of the heat sinking capability of the connector together with encapsulated flux underneath the connecto
Electronics Forum | Mon Jun 21 16:36:54 EDT 1999 | John Thorup
| | | Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of ass
Electronics Forum | Wed May 25 22:36:17 EDT 2005 | KEN
...just placed 100 xilinx 1681. These have the integrated heat sinks and bubba these need a lot of heat. You end up with 0402's on the very end of the board that get very hot (225-230) just so you can get the xilinx up to 215C at the balls.
Electronics Forum | Sun Jan 01 22:48:46 EST 2006 | Joseph
We are using selective soldering pallet, which the soldering flux is Interflux 2005M. We encountered the poor hole fill mainly at the heat sink components. Initially we tried to apply more heat but tend to overkill the flux activity. After some modif
Electronics Forum | Mon Jun 21 14:51:37 EDT 1999 | JohnW
| | Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assem
Electronics Forum | Wed Jul 12 08:49:38 EDT 2017 | williamaxler
I have a few LED pcb's that have an aluminum > substrate that are ridiculous to rework. They > heat-sink like crazy and I can't reflow the bad > LED's, no matter how much heat I apply. Any > suggestions on techniques or equipment to use? > I ha
Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan
Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.
Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev
Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
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