Industry News: high pressure (Page 6 of 74)

Nordson ASYMTEK's Vortik® Series of progressive cavity pumps dispenses one- and two-component fluids during electronics manufacturing

Industry News | 2019-11-12 13:03:48.0

Easy set-up and very low flow rates for two-component fluids result in precise, small deposits and narrow lines

ASYMTEK Products | Nordson Electronics Solutions

IPC and SMTA Announce the Session 1 Agenda for the High Performance Cleaning and Coating Conference

Industry News | 2010-09-20 19:36:19.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Surface Mount Technology Association (SMTA)

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

Electronics Industry Sentiment Rises in March

Industry News | 2024-04-03 07:15:13.0

IPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report

Association Connecting Electronics Industries (IPC)

2019 Annual Wire Harness Conference – WHMA Connects You to Resources That Make You an Industry Leader

Industry News | 2019-03-05 17:35:39.0

Lead, Educate and Connect - these three words gives the perfect insight into this year’s Wire Harness Conference. Starting with a record high of 50 attendees joining the “First Timers Session” that was led by representatives of WHMA’s Board of Directors; this meeting was to educate the participants on the association and conference, discuss industry topics, and introduce and connect the First Timers with other members throughout the conference.

Association Connecting Electronics Industries (IPC)

IPC White Paper Emphasizes the Critical Importance of Data Analytics for the Electronics Manufacturing Process

Industry News | 2024-02-26 14:30:53.0

The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC's Chief Technologist Council (CTC), Outlook for Data Analytics in the Electronics Manufacturing Industry.

Association Connecting Electronics Industries (IPC)

Electronics Manufacturing Sector Calls on Leaders of U.S., Mexico, Canada to Boost Cooperation During COVID-19 Recovery

Industry News | 2020-04-18 14:12:00.0

IPC yesterday sent a letter to U.S. President Donald Trump, Mexican President Andrés Manuel López Obrador and Canadian Prime Minister Justin Trudeau, urging them to launch a trilateral initiative to mobilize industrial base support for the continuing medical response related to COVID-19.

Association Connecting Electronics Industries (IPC)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

IWLPC Celebrates a Successful 10 Years

Industry News | 2013-11-26 14:46:08.0

The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.

Surface Mount Technology Association (SMTA)


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