Industry News | 2013-09-17 07:21:08.0
The world market for PCBs reached nearly $60 billion in 2012, with 1.7 percent real growth over 2011, according to IPC’s World PCB Production Report for the Year 2012.
Industry News | 2009-08-07 19:24:15.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2010-08-17 14:08:36.0
The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2012-04-05 13:44:28.0
IPC's second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held in Budapest, Hungary last month saw an increase of 21 percent in attendees and a 44 percent increase in exhibitors over its inaugural event last year.
Industry News | 2013-10-09 09:39:34.0
TRI and Island SMT have entered into a service agreement to support customers in Northern Mexico. This partnership will allow for a quicker service response time reducing potential down time at the customer site.
Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2009-07-24 14:12:49.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2010-09-02 11:07:09.0
The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.
Parts & Supplies | Component Packaging
Siemens F5 F5HM IC Head Shaft Ceramic 00318290-03 / 00351844-01 Detail Information: 1, Brand: Siemens AG 2, Part Name: IC Head Shaft 3, Part Number: 00318290-03/00351844-01 4, Machine Model: F5 5, Warranty: one Years 00351498-03 Valve Plun
