Industry News: immerse and tin (Page 6 of 24)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 80 Awards Presented at IPC Midwest

Industry News | 2012-08-22 15:57:01.0

IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

IPC International Symposium on Electronics and the Environment Offers Roadmap to Regulatory Compliance

Industry News | 2011-02-09 14:58:43.0

Keeping on top of ever-changing environmental regulations around the world and understanding how those regulations impact electronics manufacturers and their suppliers are the first steps on the long and winding road to compliance. Providing a roadmap to compliance, the IPC It’s Not Easy Being Green Symposium, May 11–12, 2011, in Boston, Mass., will give companies up-to-date information on the laws and regulations that affect every link of the electronics manufacturing supply chain, from Europe and Asia to South America and the United States.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

IPC Provides Input to U.S. House Oversight and Government Reform Committee

Industry News | 2012-06-07 09:26:31.0

Highlights Federal Regulations that Burden Electronics Manufacturers

Association Connecting Electronics Industries (IPC)

IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead-Free Solder

Industry News | 2003-06-11 08:00:48.0

IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020

Industry News | 2020-02-18 15:10:01.0

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 140 Awards Presented at IPC APEX EXPO

Industry News | 2013-02-20 18:54:10.0

IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Fifty Professional Development Courses at IPC APEX EXPO 2013 Go Beyond Theory with Practical Solutions and Best Practices

Industry News | 2012-11-13 09:35:09.0

Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

IPC and JEDEC Help Industry Transition to Lead Free Associations Host Conference on Transitioning to Lead Free � Strategies for Implementation

Industry News | 2009-02-21 17:56:00.0

BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.

Association Connecting Electronics Industries (IPC)


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