Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Thu Apr 01 03:04:22 EST 1999 | Scott Davies
Dave, Thanks for the interest. Basically, we looked at this project as a straight swap, i.e. printing the glue on the PCB using a Dek screen printer instead of our current method of dispensing glue using a Camalot dispensing machine. For the PCB we
Electronics Forum | Thu Sep 05 11:49:24 EDT 2002 | ppwlee
Hello, I like to hear your comments on applying SPC to solder paste printing. Specifically: - What's the most common and effective method of automated moitoring and control, Paste height/volume or printer parameters? - Actual examples in applying
Electronics Forum | Fri Feb 28 15:27:50 EST 2014 | tombstonesmt
Good afternoon! Looking to see what everyone else in the industry is running for print speeds regarding type 3 solder pastes. Our paste is a type 3 with 11.5% ROL0 flux content. The finest pitch component in our case is .5mm pitch. Our screen print
Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Electronics Forum | Wed Mar 05 17:46:19 EST 2014 | tombstonesmt
Very good suggestion. We have MPM Speedline printers. Typically we stick with the default after providing the board dimensions. Maybe there's some room there for improvement.
Electronics Forum | Thu Dec 16 20:41:56 EST 1999 | TNT
Hey C.K, If you are looking for inspection of the solder paste before reflow, there are many types of inspection: 1.Paste height measurements at random positions 2.3D inspection with shadow contrast capabilities based on an autocad format 3.3D inspec
Electronics Forum | Thu Nov 12 12:13:21 EST 1998 | Bill Schreiber
No appologies necessary, it looks like wayne@att beat me to it! Seriously, there is an article in the current November issue of Circuits Assembly magazine: "Surface-Mount Stencil Cleaning" by Nick J. Lester. From talking to Mr. Lester, I know he ha
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
