Blackfox Training Institute, LLC | https://www.blackfox.com/should-you-use-lead-or-lead-free-solder/
? As its name suggests, lead-free solder is the complete opposite of its lead-based counterpart. Instead of lead, it contains other metals like copper, silver, indium, zinc, bismuth, antimony, tin, or nickel
| https://ipcapexexpo.org/sites/default/files/inline-files/SSSchedule400andabove_0.pdf
Solder 400 Wednesday May 20, 2020 2:00 pm ‐ 3:00 pm A422 Taiyo America Inc. 400 Wednesday May 20, 2020 2:00 pm ‐ 3:00 pm A427 Asys Group Americas Inc. 1600 Wednesday May 20, 2020 2:00 pm ‐ 3:00 pm A432 Test Research USA Inc. 900 Wednesday May 20, 2020 2:00 pm ‐ 3:00 pm A433 Indium Corporation 400 Wednesday
| https://www.eptac.com/what-electronics-manufacturers-need-to-know-about-stretchable-electronics/
), a gallium and indium “syrup” is encased in a silicone-based polymer. This method allows for “printable” circuitry with very promising potential in the field of biotech
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. However, it is expensive, prone to tin whiskers due to the high Sn content. Increasing Ag% to > 5% will result in drastically higher melting temperatures. Tin-Indium
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. As stated in a article by Eric Bastow of Indium Corporation: Intermetallics in Soldering “Keep in mind that dissolution, the phenomenon of a solid dissolving into a liquid, is affected by both time and temperature
| https://www.eptac.com/blog/what-electronics-manufacturers-need-to-know-about-stretchable-electronics
), a gallium and indium “syrup” is encased in a silicone-based polymer. This method allows for “printable” circuitry with very promising potential in the field of biotech
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. However, it is expensive, prone to tin whiskers due to the high Sn content. Increasing Ag% to > 5% will result in drastically higher melting temperatures. Tin-Indium
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. As stated in a article by Eric Bastow of Indium Corporation: Intermetallics in Soldering “Keep in mind that dissolution, the phenomenon of a solid dissolving into a liquid, is affected by both time and temperature
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=114
. Horizon Sales ICAPE-USA Indium Corporation Inovaxe InsulFab PCB Tooling KIC Kurt Whitlock Associates Kurtz Ersa, Inc. KYZEN Corporation Lindstrom Precision Tools LPMS USA Maximum / Pioneer Circuits METCAL MicroCare Corporation Nikon Metrology, Inc
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=29
.) Communications Manager (Appointed) : Sarah Grimm (Invacare) Young Professional Lead (Appointed) : Kay Parker (Indium Corporation) Board Liaison : Gregory Vance (Rockwell Automation) Back to Top Global Members of our Chapter Metallic Resources, Inc
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