Full Site - : indium 8.9hf lead free paste (Page 6 of 29)

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Industry News | 2013-11-01 13:32:41.0

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.

Indium Corporation

Full Range of Pb-Free Materials for Electronics Assembly Featured at Indium Corporation Exhibit

Industry News | 2005-09-09 09:59:58.0

Indium Corporation of America will be exhibiting their Pb-Free Suite of Materials at the Assembly Technology Expo in Rosemont, IL on Sept. 26-28, 2005

Indium Corporation

Indium Corporation to Feature WEEE/RoHS Compliant Materials at Productronica

Industry News | 2005-10-20 11:39:06.0

Indium Corporation will be exhibiting its Suite of Pb-Free Electronics Assembly Materials for WEEE and RoHS compliance at the Productronica show in Munich, Germany on November 15-18, 2006.

Indium Corporation

Indium Corporation Features Ultra-Low Voiding Solder Paste at Productronica

Industry News | 2007-10-23 17:27:36.0

Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;

Indium Corporation

Indium Corporation Announces New Solder Paste Technology

Industry News | 2014-01-31 00:23:23.0

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.

Indium Corporation

Indium Corporation Features BiAgX™: New, High Temperature, Lead-Free Solder Paste Technology at Semicon China.

Industry News | 2014-03-04 11:29:02.0

Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.

Indium Corporation

Indium Corporation Announces High-Melting Pb-free Solder Alternatives Agreement with Ormet Circuits

Industry News | 2010-04-23 18:53:17.0

Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.

Indium Corporation

Indium Corporation Features SACm™ at NEPCON China

Industry News | 2014-04-03 13:47:58.0

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.

Indium Corporation

Indium Corporation to Exhibit at ATExpo

Industry News | 2004-09-02 22:58:52.0

Indium Corporation of America will be exhibiting at Assembly Technology Expo (booth # 5631)

Indium Corporation


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