Electronics Forum: inspection after screen printing (Page 6 of 37)

B.I.C. SMT Process Controls

Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand

Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y

Solder Paste Volume

Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson

Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa

Paste Penetration in Via for Paste Through Hole

Electronics Forum | Tue May 12 04:15:48 EDT 1998 | Chris Sargent

Help! We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The pro

stencil cleaning

Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber

Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures

Assembly of flexi (flexible) circuit boards

Electronics Forum | Thu Jun 26 10:03:36 EDT 2003 | swagner

We have been processing a 3 and 5 up flex array for nearly four years on pallets and have had a pretty steep learning curve. Make sure you have vacuum holes in your pallet for the screen printing process, also work with your support block vendor to

Solder Paste Inspection

Electronics Forum | Fri Jun 08 12:05:17 EDT 2007 | bbl

If you're not doing any fine pitch or BGA's, it's a "nice to have". With manual screen printing any paste height measurement tool you got would likely generate more fails than you could deal with unless you set the parameters so wide that almost any

BGA Rework

Electronics Forum | Mon Apr 28 08:52:10 EDT 2003 | davem

Chrissie, I'm glad you (and your people) made it through the painful process of reworking all those BGA's. Hope all your boards sucessfully pass test. Now on to the larger issue. In my experience, the solder paste screen printing process is (along

AOI, Pre or Post Reflow?

Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc

Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for

Screen Printing Print Validation

Electronics Forum | Tue Nov 01 19:53:23 EST 2005 | KEN

Um...for you mylar guys....esd safe? Why worry about the first two prints. Worry if they power up or not when sent to funcitonal test. Zapp! I think I know where this is comming from. It is not that uncommon to have a sacrificial print. However,

MPM AP25, separation problems

Electronics Forum | Wed Nov 02 08:16:31 EST 2005 | pavel_murtishev

Hi! It goes away only for one or two print strokes. After them the problem arises again. After first print stroke I inspect a lot of �dog ears� and a lot of paste not released from the stencil (it�s not a stencil design problem, other machine prints


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