Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu Sep 07 12:42:53 EDT 2000 | Vincent Geesing
Hi, my name is Vincent Geesing. I�m a student computer engineering in the Netherlands. We (me and 3 other guys) are developing a motorized car who can find his way himself. The car must go straight and avoid some obstacles on his way. It drives in a
Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker
Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi
Electronics Forum | Tue Nov 16 14:38:46 EST 1999 | Scott S. Snider
So far I'm into the investigation stage of the AOI project. The system I'm most interested in is the Intelligent Reasoning Systems, Inc. I'm after fast programming with minimal false calls. I'm not interested in X-ray. I saw the system at NEPCON
Electronics Forum | Tue Nov 16 14:42:25 EST 1999 | Scott S. Snider
So far I'm into the investigation stage of the AOI project. The system I'm most interested in is the Intelligent Reasoning Systems, Inc. I'm after fast programming with minimal false calls. I'm not interested in X-ray. I saw the system at NEPCON
Electronics Forum | Thu Dec 17 10:25:19 EST 1998 | Earl Moon
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Mon Dec 21 17:50:55 EST 1998 | anamonus
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Tue Dec 15 17:01:36 EST 1998 | Chrys
| Does anyone know what a TCP is? | What type of process is required for assembly, what type of equipment? | | Any help or resources on the subject would be greatly appreciated.. | | Thanks | Brain, TCP, or tape carrier package is the same as TAB
Electronics Forum | Mon Sep 14 16:44:37 EDT 1998 | Steve A
| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for C
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