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:30 AM Keynote Address 2: Assembly, Reliability, and Testing (A.R.T.) of LED Luminaires Warren Weeks, Hubbell Lighting, Inc. 9:15 AM Mimicking Real LED Lamp Stress Factors
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) evolution for many years. You can find PCBs in almost every electronic gadget. Over the last decade, High-Density Interconnect (HDI)… Read More Oct 29 Self-Driving Capabilities Driving PCB Innovation By Khurrum Dhanji Blog , Industry News Today, technology is integrated into all aspects of our lives
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system’s low force capabilities and specialist tooling allow brittle fracture testing of materials such as silicon and glass. Low Cycle Fatigue of Individual Soldered Interconnect Application Note Nordson DAGE Brittle Fracture Micro Bend Application Note Nordson DAGE 4000HS High Speed Bondtesting Brochure Nordson DAGE 4000
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presence of micro cracks and surface defects such as scratches and chips. In these materials, the high level of stress at the tip of a crack cannot be relieved by plastic flow and so even very small defects can lead to low failure loads