| https://www.smtfactory.com/I-C-T-High-end-AOI-Machine-and-X-Ray-Chip-Counter-id47378747.html
market changes and enhance core competitiveness. AOI optical inspection equipment for industry 4.0 to achieve centralized management, multi-equipment interconnection in
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_Brochure_PCED.pdf
. Pritchard Hall of Fame Award in 2015, recognizing his contributions to the electronic interconnection industry, as well as to the association
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Paul Totta, IBM, East Fishkill, New York "Paradigm Shift in Interconnection Technologies" 1996: Steve Greathouse, Intel Corporation, Arizona "Critical Issues with Chip Scale Packages (CSPs)" 1995
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/quotes.cfm
. Electronic interconnection system level trends create both challenge and disruption. Connecting and learning from knowledge experts is one of the many benefits of attending SMTA International
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. A key technology for WLP is its interconnection layers from bare-die IO pads to solder balls: redistribution layers (RDLs). Packaging’s essential role is to interconnect between die pads with
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
copper braid), which are used in applications where shielding of the centre conductors from the surrounding electrical ambient is required. The interconnection of those shielded cables, not covered by the present standard, is covered in
Blackfox Training Institute, LLC | https://www.blackfox.com/about/news-events/
/WHMA-A-620 is a training and certification granted by the Institute of Printed Circuits/Wire Harness Manufacturers Association. It describes the criteria for acceptability for crimped, mechanically secured, and soldered interconnection and the
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
and James Malatesta Abstract 12-1 PACKAGE-TO-BOARD INTERCONNECTION AND RELIABILITY OF BGA PACKAGES OVER EXTENDED TEMPERATURE RANGE* Puligandia Viswanadham et al. Abstract 12-1 SOLDER JOINT RELIABILITY OF THE BLP PACKAGE Kwang-Seong Choi et al. Abstract
