Full Site - : intermittent failure (Page 6 of 7)

Flux residues

Electronics Forum | Thu Nov 15 15:27:50 EST 2012 | davef

Finally, help for those searching for compatibility A new standard and guideline will make it much simpler for users to determine whether they’ve got the right chemistry to ensure compatibility. April 23, 2012 By Terry Costlow, IPC online edit

SMT Heal Issue

Electronics Forum | Thu Jul 28 22:35:58 EDT 2011 | davef

The consequences of poor heel formation in solder connections include: * Lower solder joint strength * Possible intermittent short circuits * Reduced first-pass yields * Increased inspection cost * Increased rework cost * Likely field failures * Like

Cracks on ceramic capacitors.

Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob

Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion

PCB Surface Cleaner

Electronics Forum | Wed Dec 07 13:10:32 EST 2011 | conjugate

Hi Reese, the contamination is coming from the material of the PCB itself. Basically, there`re failure observed in the products from electronics factory. preliminary analysis been done, the main board not properly functioning due to bad solder. next

Porosity in Good Plating

Electronics Forum | Tue Jul 15 18:44:20 EDT 2003 | davef

Sam says, �The only question remaining to me is that why the failure happened after 48 hours instead of immediate failure after soldering.� Let�s recap: * Had good-looking solder flow. * Passed the initial electrical test. * Failed the later electri

NASA-UA report update

Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel

Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs

Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t

Re: Electronic manufacturing company near the beach.

Electronics Forum | Thu Sep 16 07:57:26 EDT 1999 | Seli

| | Is feasible to have an electronic manufacturing company near the beach? How affect the corrosion the electronic components? | | | I guess it depends what you mean by 'near'. Will the building be a custom design or an existing one? What kind of p


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