149 ipc tm 650 2.3.28 results

Electronics Forum: ipc tm 650 2.3.28 (Page 6 of 15)

PCB assembly bow and twist

Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo

Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.

Re: environmental testing

Electronics Forum | Tue Feb 24 18:21:52 EST 1998 | Graham Naisbitt

You should refer to the IPC-J-STD001B and IPC-TM-650, they will give you good recommendations. Also, we do new reliability test systems and if you can give me your address and e-mail, I will send you some more info. Regards, Graham Naisbitt | looking

Black Pad

Electronics Forum | Tue Jan 10 22:10:58 EST 2006 | davef

Muse We don't believe that the IPC TM-650 Test Methods Manual, 2.4.1E, Adhesion, Tape Testing--5/04 [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf ] that you refer to is a "black pad" test. We think it's a method for testing the a

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens

Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,

baking PWB standard??

Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef

Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from

Who has experience in IPC-TM-650 2.6.3.1 Environment test Method

Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry

PCB Warpage

Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef

Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect

warpage for 152mm length PCB

Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef

Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies

International certification programme for lead-free product test

Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef

Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior