Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Thu May 16 11:37:13 EDT 2002 | fmonette
My company offers a simple and cost effective control system for MSDs on the factory floor. It is a turnkey solution to comply with J-STD-033. If you want more information feel free to contact me offline. Francois Monette Cogiscan Inc. Tel : 450-53
Electronics Forum | Thu Mar 20 15:12:01 EST 2003 | fmonette
Hi Carol, You can find many complete articles on the subject of MSD Control in the MSD Knowledge Base on our web site at http://www.cogiscan.com Do not hesitate to contact me directly if you have specific questions. My company is an active member
Electronics Forum | Tue May 18 17:07:18 EDT 2004 | gabriele
Wave Solder temperature should not cause problem to MSDs. Just in case on PBA there are very critical MSLs (ie. 5 or 5a, 6 (?!?) try to detect what is the max temperature on such MSD bodies and how long they stay under such temperature. But it schoul
Electronics Forum | Wed Jun 23 19:44:58 EDT 2004 | kennyg
J-STD-033A specifies a 1 year exposure life for moisture sensitive level 2 components, but no baking temp/duration for anything less than a level 2a part. Although the need is rare, what does a person do to dry a level 2 part that has been exposed f
Electronics Forum | Fri Feb 03 02:04:16 EST 2006 | pavel_murtishev
Good morning James, It depends on MSD class. Refer to J-STD-033. When you open dry bag shelf life starts. You have to mount all devices before maximum allowable shelf life time exceeds. Storing in dry cabinet capable maintaining RH
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Wed Jun 10 22:47:17 EDT 2009 | davef
You're correct that JEDEC J-STD-033 defines baking condidtions for moisture sensitive components. Why do you want to bake assemblies after cleaning? Search the fine SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Me
Electronics Forum | Mon May 31 03:53:38 EDT 2010 | saa
Hi Nicolas, For level 4 and above you can NOT stop the floor life when the items are exposed for more than 8 hrs even if you store them in a dry cabinet or seal them back in MBB. For Level 3 and below you can stop/ pause the floor life whenever y
Electronics Forum | Fri Apr 15 14:25:57 EDT 2011 | ryanr
We've received in a batch of ICs (Xilinx FPGAs) from a customer on consignment that are having wetting issues. I believe the chips are contaminated. We also know that the chips were bought from a broker. Is there a method to remove the contamination
