Electronics Forum: j-std-001%2c class 3 (Page 6 of 37)

Soldering Specification Needed

Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101

The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

When does SMT inspection/touch-up become rework?

Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson

You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented

Undersized Land Width from PCB Fab - Help!

Electronics Forum | Tue Nov 09 14:34:25 EST 2004 | russ

Can class 3 be met without a side fillet?

SOLDERABILITY OF PCBS

Electronics Forum | Tue Nov 05 06:10:56 EST 2019 | amitthepcbguy

IPC- JSTD-001 Class-3: this is a complete guide to the solderability tests, please refer to the specifications.

Voiding in board to BGA joints

Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy

1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3

defects in pcb manufacturing

Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar

Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin

The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class

Wave Soldering Upflow

Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.

Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor

Torque Setting

Electronics Forum | Mon Aug 02 09:26:15 EDT 2004 | davef

Q1: How do you define torque setting for screw? A1: Talk to people at your nut supplier. Some nut suppliers post torque tables on the web. For instance: http://www.thelenchannel.com/1torque.html http://www.marfas.com/Ttorque.shtml http://www.pac


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