Industry News | 2018-01-31 08:06:54.0
Apex Factory Automation introduces the new SJIT HP-520E printer. This platform retains most of the features of its predecessor, the popular HP-520S, but at a new, lower price point.
Industry News | 2018-02-14 20:25:37.0
Apex Factory Automation introduces the new SJIT HP-520E printer. This platform retains most of the features of its predecessor, the popular HP-520S, but at a new, lower price point.
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2021-02-12 16:21:55.0
Inovaxe will exhibit in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Inovaxe will showcase the new SR100E Replenishment Rack, designed for operation on the production line right next to the pick-and-place machines to facilitate efficient feeder replenishment.
Industry News | 2017-11-02 14:31:37.0
Kurtz Ersa North America is pleased to announce plans to hold a one-day technology seminar on Wednesday, December 6 or Thursday, December 7, 2017 in San Jose, CA. Ersa and the INTERFLUX® Electronics team will present revolutionary developments in a low melting point solder alloy that improves quality, lowers costs and maximizes equipment efficiency.
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2020-11-11 22:16:21.0
Introduce our Bell's high and low temperature test chambers, constant temperature and humidity test chambers, both of which are also environmental chambers for battery safety.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.