Electronics Forum | Mon Mar 21 12:12:43 EST 2005 | GS
Many thanks Davef. Regards........... GS
Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ
proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?
Electronics Forum | Wed Feb 21 15:24:29 EST 2007 | wavemasterlarry
I saw that software used by our guys. Takes an Army of guys to run it, not worthit to me.
Electronics Forum | Fri Feb 16 11:07:25 EST 2007 | stepheniii
I'm not sure if anyone mentioned the single most important factor. p.m.'s. If the nozzles are getting dirty and clogged it's not going to do a great job of picking parts up. Don't think in terms of variation. It's there it's unavoidable and undet
Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin
Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Electronics Forum | Fri Jul 15 09:43:37 EDT 2005 | dougs
HHmmmm!! looks like i'm getting it way wrong by wanting to chart the quality of product coming from my wave solder machine. could some of you let me know whats the best way to monitor quality on this process.
