Electronics Forum | Thu Feb 10 04:37:29 EST 2000 | Wolfgang Busko
Russ: If it�s true that they have been reworked to HASL I guess that something went awefully wrong at that stage. If you have some bareboards left have them checked thoroughly. M2C Wolfgang
Electronics Forum | Fri Mar 17 03:27:20 EST 2000 | Wolfgang Busko
Darren: Do you know what these residues are ? How clean is your solderbath ? How often during a day do you clean it ? My first impression is that you deal with oxides. M2C Wolfgang
Electronics Forum | Thu Jan 13 12:36:09 EST 2000 | Wolfgang Busko
Tony: Have a mask applied by the boardhouse which can be removed after soldering. We worked with pallets or tape but had bad luck with some boards. At present I would prefer a mask. M2C Wolfgang
Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko
Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
Electronics Forum | Thu Apr 27 10:32:51 EDT 2000 | Wolfgang Busko
If you look at Phillips, for example, or Siemens, they offer on their websites their own equipment. The other stuff is contract stuff and normally not supported. If you ask directly they might get the stuff for you together but they won�t do it for n
Electronics Forum | Wed Apr 26 11:50:18 EDT 2000 | Wolfgang Busko
Hi Sal, the way you do it has IMO some advantages: - no sophisticated support for the topside print - no extra thermal stress for the the bottomside bonding material - less possibilities to lose bottomside components by handling One disadvantage mig
Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko
Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
